13 ott - Milano
Informatica / Software
Bending Spoons is offering an internship for outstanding students to work across Milan, London, Madrid, and Warsaw from June to September 2027. You'll own real work that reaches customers, learn rapidly, and contribute to shaping products in a fast-paced, highly collaborative environment.
Expect to join small, entrepreneurial teams and tackle high-impact initiatives. You'll gain hands-on experience with AI-driven product development and a strong emphasis on rigorous experimentation and
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