Process Integrator
Pubblicato il 15-10-2026 - Ephos in Milano
Process Integrator
Advanced Packaging & Glass Substrates
About Ephos
Ephos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers.
We have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant—the first ever awarded to a startup.
The role
We are seeking a Process Integrator to drive the development of next-generation microelectronics modules. In this role, you will be the architect of our process flows, connecting individual unit steps (such as lithography, etching, metallization, and bonding) into a cohesive, high-yielding manufacturing line.
You will design project-oriented integration flows by maximizing our internal R&D; equipment baseline and establishing strategic external partnerships. Once a robust process flow is established, you will champion the technology transfer to our mass manufacturing teams.
Your responsibilities
• Design, develop, and execute end-to-end integration flows for advanced packaging schemes on glass substrates.
• Assess internal R&D; tool capabilities to build prototype flows. Where gaps exist, identify, negotiate, and manage technical relationships with external foundries, OSATs, or research institutes to complete the flow.
• Stay at the forefront of state-of-the-art advanced packaging techniques (e.g., 2.5D/3D integration, wafer-level packaging, chiplet integration) and evaluate how to implement them into current projects.
• Analyze physical, chemical, and mechanical interactions between sequential process steps (e.g., thermal mismatch, warpage, adhesion layer integrity) to resolve complex integration bottlenecks.