16 ott - Milano
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment. #J-18808-Ljbffr
17 ott - Piove di sacco
In Job S. P. A.
17 ott - Roma
elettroteammarrinisrls
17 ott - Piove di sacco
In Job S. P. A.
17 ott - Sestu
OPENJOBMETIS