Principal Engineer GaN Package Development

16 ott - Sicilia
Nexperia

We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing. Responsibilities * Lead development, optimization, and implementation of GaN packaging and assembly processes * Define package architectures aligned with performance, reliability, and cost targets * Collaborate cross-functional (R&D;, design, production, quality, purchasing) for seamless transfer to manufacturing * Specify, select, and qualify equipment, materials, and tooling * Develop and maintain process documentation, specifications, and engineering change records * Provide technical expertise to troubleshoot manufacturing issues and lead root cause analysis * Manage supplier qualification and support technology transfer for outsourced processes * Drive yield, quality,



and continuous improvement using SPC and data-driven methodologies Requirements * Bachelor's or Master's degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or related field * Strong experience in semiconductor backend R&D; and manufacturing, including assembly and packaging * Solid understanding of semiconductor backend processes and connection technologies * Knowledge of GaN packaging, device characteristics, and related manufacturing challenges (advantageous) * Familiarity with measurement systems, industry standards, and best practices * Strong analytical skills, including data interpretation, root cause analysis, and Six Sigma methodologies * Effective communication skills with a collaborative, cross-functional mindset * Results-driven, quality-focused, with the ability to manage multiple priorities independently Department and Colleagues Nexperia is a global leader in semiconductor components, powering essential electronics across automotive,

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