17 ott - Catania
Nexperia
We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing.
This is your new job:
Lead development, optimization, and implementation of GaN packaging and assembly processes
Define package architectures
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OPENJOBMETIS