17 ott - Italia
Nexperia
We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing.
Responsibilities
- Lead development, optimization, and implementation of GaN packaging and assembly processes
- Define package architectures aligned with performance, reliability, and cost targets
- Collaborate cross-functional (R&D;, design, production, quality, purchasing) for seamless transfer to manufacturing
- Specify, select, and qualify equipment, materials, and tooling
- Develop and maintain process documentation, specifications, and engineering change records
- Provide technical expertise to troubleshoot manufacturing issues and lead root cause analysis
- Manage supplier qualification and support technology transfer for outsourced processes
- Drive yield, quality, and continuous improvement using SPC and data-driven methodologies
Requirements
- Bachelor's or Master's degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or related field
- Strong experience in semiconductor backend R&D; and manufacturing, including assembly and packaging
- Solid understanding of semiconductor backend processes and connection technologies
- Knowledge of GaN packaging, device characteristics, and related manufacturing challenges (advantageous)
- Familiarity with measurement systems, industry standards, and best practices
- Strong analytical skills, including data interpretation, root cause analysis, and Six Sigma methodologies
- Effective communication skills with a collaborative, cross-functional mindset
- Results-driven, quality-focused, with the ability to manage multiple priorities independently
Department and Colleagues
Nexperia is a global leader in semiconductor components, powering essential electronics across automotiv
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