Wafer/Package Level Testing Engineer
Pubblicato il 17-10-2026 - Stmicroelectronics in Re
OUR STORYAt STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society.
As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.
Legga attentamente tutte le informazioni su questa occasione, quindi utilizzi il pulsante di candidatura sottostante per inviare il suo CV.
When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.
Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect.
People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.
Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way.
Our technology starts with you.
YOUR ROLEThe candidates work comprises planning,
execution, surveillance, data analysis, and reporting of package/wafer level for Electrical Wafer Sorting/Final Test for Reliability supporting on prototypes of discrete power technologies under development (SiC, IGBT, GaN) and on the Bench Characterization of power device (oxides-like SiO2 thermal and deposited oxides, IMD, PMD) and T84 structures.
He/She will be involved in the early evaluation of device physics of MOSFETs.
He/She will contribute to the single steps of technology qualification validating the Electrical Static performances and identifying, in case of out of spec, the weaknesses helping on the resolving technology issues arised.
YOUR SKILLS & EXPERIENCESMaster degree in physics, material science or electrical/physical engineering.
2 years of experience
Knowledge of reliability physics, semiconductor physics, electronic devices, and electrical characterization methods are require