Power Device Wafer & Package Test Engineer

17 ott - Catania
STMicro

STMicroelectronics in Italy is seeking a candidate to plan, execute, and analyze package/wafer level tests for reliability in our power device prototypes (SiC, IGBT, GaN) and bench characterization.

You will join a global team, require a master's in physics or related field, about 2 years' experience, strong English, and skills in programming and numerical modeling. The role offers a competitive salary and growth opportunities.

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