Computational EM Engineer for High Speed Interconnects
Pubblicato il 18-10-2026 - HUAWEI TECHNOLOGIES ITALIA in Ascoli Piceno
The Central Hardware Engineering Institute (CHEI) at Huawei Milan Research Center develops advanced computational methods and engineering technologies for next-generation ICT systems. Our work combines computational electromagnetics, numerical algorithms, software engineering, and high-speed interconnect design to create reusable methodologies that accelerate hardware development across multiple product generations. We are looking for engineers who enjoy solving challenging computational and physical problems and transforming advanced numerical techniques into practical engineering tools used by hardware development teams worldwide. Role Overview You will develop computational methodologies, electromagnetic models, and engineering software for the analysis and optimization of high-speed interconnect systems. Working at the intersection of computational EM, numerical methods, and software engineering, you will create reusable workflows that enable faster, more reliable hardware design while collaborating closely with signal integrity and hardware engineers.
The role is ideal for candidates with strong computational and electromagnetic fundamentals who enjoy building robust engineering methodologies rather than performing one-off analyses. Responsibilities In this role, you will have the opportunity to: * Develop computational electromagnetic methodologies for the modeling and optimization of high-speed interconnect systems. * Design numerical algorithms and reusable software tools that improve engineering productivity, reproducibility, and scalability. * Build physics-based models, reduced-order models, optimization workflows, and automation pipelines for complex engineering problems. * Validate simulation results, assess numerical accuracy and convergence, and distinguish physical effects from numerical artifacts. * Apply computational methods to practical engineering challenges involving PCBs, packages, connectors, cables, and complete communication channels. * Col