19 ott - Assago
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer
Non aspetti a candidarsi dopo aver letto questa descrizione: per questa occasione è previsto un elevato volume di candidature.
- Staff.
You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams.
Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging.
Strong communication and knowledge of semiconductor materials are essential. xysqume
This full-time role supports innovation in a dynamic environment.
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