21 ott - Mantova
Intellectual Capital Resources
My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology. You will help take devices from laboratory prototypes towards production-ready modules. This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team. This is an onsite role, based in Milan.
Job responsibilities
- Support the packaging and integration of photonic integrated circuits, from prototype development through to product testing - Assist with optical coupling, fibre alignment, attachment and bonding processes - Help develop and improve assembly and packaging processes for manufacturability and scalability - Carry out optical characterisation, testing and basic failure analysis of packaged devices - Analyse experimental results and support improvements to package performance, reliability and yield - Work closely with photonics, electronics and R&D; teams to integrate packaging requirements into product development
Experience required
- Degree in Photonics, Optical Engineering,
Electronic Engineering, Materials Science or a related discipline - Some hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related field - Understanding of optical coupling, fibre alignment and attachment techniques - Familiarity with photonic assembly processes and packaging technologies - Basic knowledge of electrical interfaces, RF connectivity or optoelectronic integration - Experience with laboratory testing, optical characterisation or experimental measurements - Strong problem-solving skills and a willingness to develop practical engineering solutions - Ability to work collaboratively within a multidisciplinary engineering team
Desirable
- Exposure to optical communications is preferred, but not essential - Exposure to reliability testing, environmental qualification or failure analysis - Experience working with external foundries, assembly houses or substrate suppliers
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