22 ott - Romano di Lombardia
Intellectual Capital Resources
Intellectual Capital Resources Ltd in Milan hires a Photonics Packaging Engineer to move PIC devices from lab prototypes toward production-ready modules.
Le seguenti informazioni hanno lo scopo di fornire ai potenziali candidati una migliore comprensione dei requisiti per questo ruolo.
You’ll gain hands-on packaging experience within a growing photonics team at an onsite Milan site. xbvzest
Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D; teams.
23 ott - Mantova
Dr. Beckmann Group
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Gruppo Sicis
23 ott - Italia
Experis Italia
23 ott - Prato
Baxenergy