22 ott - Lombardia
Intellectual Capital Resources
My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology. You will help take devices from laboratory prototypes towards production-ready modules. This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team. This is an onsite role, based in Milan.
Support the packaging and integration of photonic integrated circuits, from prototype development through to product testing
Assist with optical coupling, fibre alignment, attachment and bonding processes
Help develop and improve assembly and packaging processes for manufacturability and scalability
Analyse experimental results and support improvements to package performance, reliability and yield
Work closely with photonics, electronics and R&D; teams to integrate packaging requirements into product development
Experience required
Degree in Photonics,
Optical Engineering, Electronic Engineering, Materials Science or a related discipline
Some hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related field
Understanding of optical coupling, fibre alignment and attachment techniques
Familiarity with photonic assembly processes and packaging technologies
Experience with laboratory testing, optical characterisation or experimental measurements
Strong problem-solving skills and a willingness to develop practical engineering solutions
Ability to work collaboratively within a multidisciplinary engineering team
Exposure to reliability testing, environmental qualification or failure analysis
Experience working with external foundries, assembly houses or substrate suppliers
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