Photonics Packaging Engineer
Pubblicato il 22-10-2026 - Intellectual Capital Resources in Bardi
My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology.
You will help take devices from laboratory prototypes towards production-ready modules.
This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team.
This is an onsite role, based in Milan.Job responsibilitiesSupport the packaging and integration of photonic integrated circuits, from prototype development through to product testingAssist with optical coupling, fibre alignment, attachment and bonding processesHelp develop and improve assembly and packaging processes for manufacturability and scalabilityCarry out optical characterisation, testing and basic failure analysis of packaged devicesAnalyse experimental results and support improvements to package performance, reliability and yieldWork closely with photonics, electronics and R&D; teams to integrate packaging requirements into product developmentExperience requiredDegree in Photonics, Optical Engineering,
Electronic Engineering, Materials Science or a related disciplineSome hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related fieldUnderstanding of optical coupling, fibre alignment and attachment techniquesFamiliarity with photonic assembly processes and packaging technologiesBasic knowledge of electrical interfaces, RF connectivity or optoelectronic integrationExperience with laboratory xysqume testing, optical characterisation or experimental measurementsStrong problem-solving skills and a willingness to develop practical engineering solutionsAbility to work collaboratively within a multidisciplinary engineering teamDesirableExposure to optical communications is preferred, but not essentialExposure to reliability testing, environmental qualification or failure analysisExperience working with external foundries, assembly houses or substrate suppliers#J-*****-Ljbffr