Computational Electromagnetics Engineer
Pubblicato il 26-10-2026 - Microtech Global in Milano
Location: Milan, Italy
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Salary: €60,000 to €75,000, plus discretionary premio
We are recruiting for a global technology company developing advanced computational methods for next-generation hardware and communication systems.
This role combines computational electromagnetics, numerical methods and software engineering. You will develop electromagnetic models, numerical algorithms and reusable engineering tools for analysing and optimising high-speed interconnect systems.
Rather than carrying out one-off simulations, you will build robust methodologies and automated workflows that can be used across multiple products and hardware generations. Your work will cover PCBs, semiconductor packages, connectors, cables and complete communication channels.
You will develop physics-based and reduced-order models, optimisation workflows and simulation automation tools. You will also validate results, assess numerical accuracy and convergence, and distinguish genuine physical behaviour from numerical artefacts.
Working closely with signal integrity and hardware engineers, you will translate complex computational results into practical design guidance and contribute to the team’s longer-term technical roadmap.
Your background
You will have a strong understanding of computational electromagnetics, numerical methods or scientific computing, developed through an advanced degree or relevant industrial or research experience.
You should have hands‑on experience with electromagnetic simulation tools such as HFSS, CST Studio Suite,
COMSOL Multiphysics, Keysight ADS or an equivalent framework. Experience developing numerical algorithms, engineering software or automated simulation workflows using Python, C++, MATLAB or a similar language is also important.
You should be comfortable evaluating the quality of simulation results, including numerical accuracy, convergence and model validation, rather than simply operating existing simulation tools.
Candidates may come from computational electromagnetics, RF, antennas, microwave engineering, integrated photonics, computational physics, electronic packaging, applied mathematics or related disciplines. Previous high-speed signal integrity experience would be useful, but it is not essential.
Additional experience
Experience with transmission line theory, interconnect modelling, channel analysis, impedance discontinuities, eye diagrams, BER, TDR or TDT, crosstalk and channel compliance would strengthen your application.
Knowledge of PCIe, Ethernet, DDR, USB or SerDes would also be valuable, as would experience in advanced packaging, chip-package co-design or heterogeneous integration.
The team is also interested in candidates with experience in model order reduction, surrogate modelling, numerical optimisation, uncertainty quantification, Monte Carlo analysis, Design of Experiments or machine learning for computational physics.
You are not expected to cover every area. xbvzest The priority is strong electromagnetic and computational knowledge, combined with an interest in developing reliable and reusable engineering solutions.