Photonics Packaging Engineer
Pubblicato il 29-10-2026 - Ic Resources in Ascoli Piceno
My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology. You will help take devices from laboratory prototypes towards production-ready modules. This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team. This is an onsite role, based in Milan. Job Responsibilities
* Support the packaging and integration of photonic integrated circuits, from prototype development through to product testing
* Assist with optical coupling, fibre alignment, attachment and bonding processes
* Help develop and improve assembly and packaging processes for manufacturability and scalability
* Carry out optical characterisation, testing and basic failure analysis of packaged devices
* Analyse experimental results and support improvements to package performance, reliability and yield
* Work closely with photonics, electronics and R&D; teams to integrate packaging requirements into product development Experience Required
* Degree in Photonics, Optical Engineering, Electronic Engineering, Materials Science or a related discipline
* Some hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related field
* Understanding of optical coupling, fibre alignment and attachment techniques
* Familiarity with photonic assembly processes and packaging technologies
* Basic knowledge of electrical interfaces, RF connectivity or optoelectronic integration
* Experience with laboratory testing, optical characterisation or experimental measurements
* Strong problem-solving skills and a willingness to develop practical engineering solutions
* Ability to work collaboratively within a multidisciplinary engineering team
* Exposure to optical communications is preferred, but not essential
* Exposure to reliability testing, environmental qualification or failure analysis
* Experience working with external foundries, assembly houses or substrate suppliers #J-18808-Ljbffr