30 ott - Milano
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer
- Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.
D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
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