30 ott - Romano di Lombardia
Ephos
Ephos is building vertically integrated, advanced packaging solutions on glass panels, transforming raw glass into electronic and optically active substrates for die-to-die connectivity, with in-house production.
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Our team is expanding a new fabrication facility to scale production 100x, backed by a $50M EU CHIPS Act grant, reflecting ambitious growth and market leadership. The Photonics xcldrub Engineer will own the femtosecond laser writing process, drive PIC advancement, and bridge R&D; with
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