Photonics Engineer: PIC Design
Ephos is building vertically integrated, advanced packaging solutions on glass panels, transforming raw glass into electronic and optically active substrates for die-to-die connectivity, with in-house production.
Si candidi ora: legga i dettagli del lavoro scorrendo verso il basso. Verifichi di possedere le competenze necessarie prima di inviare la candidatura.
Our team is expanding a new fabrication facility to scale production 100x, backed by a $50M EU CHIPS Act grant, reflecting ambitious growth and market leadership. The Photonics xcldrub Engineer will own the femtosecond laser writing process, drive PIC advancement, and bridge R&D; with
Si candidi ora: legga i dettagli del lavoro scorrendo verso il basso. Verifichi di possedere le competenze necessarie prima di inviare la candidatura.
Our team is expanding a new fabrication facility to scale production 100x, backed by a $50M EU CHIPS Act grant, reflecting ambitious growth and market leadership. The Photonics xcldrub Engineer will own the femtosecond laser writing process, drive PIC advancement, and bridge R&D; with