Photonics Packaging Engineer — Milan, Lab to Production
Intellectual Capital Resources Ltd in Milan hires a Photonics Packaging Engineer to move PIC devices from lab prototypes toward production-ready modules. You’ll gain hands-on packaging experience within a growing photonics team at an onsite Milan site.Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D; teams.#J-18808-Ljbffr