Process Integrator: Glass Packaging & HVM Transfer
Ephos is building vertically integrated, advanced packaging solutions on glass panels. We seek a Process Integrator to architect end-to-end integration flows for next-generation microelectronics modules, connecting lithography, etching, metallization, and bonding into high-yield manufacturing lines.
You will design project-oriented integration flows, leverage internal R&D; tools, and establish external partnerships, with a strong emphasis on transferring mature processes to mass production.
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You will design project-oriented integration flows, leverage internal R&D; tools, and establish external partnerships, with a strong emphasis on transferring mature processes to mass production.
#J-18808-Ljbffr