Chip-Package Interaction Engineer
STMicroelectronics in Agrate Brianza, Italy, is seeking a specialist to develop pad/pad over active structures for Smart Power processes and to qualify them through dedicated tests to release reliable structures.
You will coordinate activities to validate the CPI of new Smart Power Technology Platforms/Modules and perform thermo-mechanical simulations (FEM) of chip-package interactions to improve robustness.
You will coordinate activities to validate the CPI of new Smart Power Technology Platforms/Modules and perform thermo-mechanical simulations (FEM) of chip-package interactions to improve robustness.