Thermo-Mechanical Chip-Package Engineer
STMicroelectronics Italia is seeking an early-career to senior materials/physics/electronics specialist to design and qualify pad/pad over active structures for Smart Power processes. The role involves thermo-mechanical simulations and close collaboration with designers to ensure reliable structures.
You will coordinate CPI validation activities and work with EWS, assembly, and reliability tests across multiple platforms, aiming at robust, manufacturable solutions.
You will coordinate CPI validation activities and work with EWS, assembly, and reliability tests across multiple platforms, aiming at robust, manufacturable solutions.