MTS, NAND PI
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description
As aMember of Technical Staff inNAND Module Process IntegrationTeamthe Singapore R&D; department at MicronSemiconductor Operation Pte Ltd,you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following:
* Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
* Specification definition : Define structural specifications and process requirements for assigned modules.
* Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
* Proactive Issue Resolution: Be proactive inidentifyingpotentialstructure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
* Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
* Material Innovation: Analyze materials physically, electrically, etc. and work with process groups,etcto select new material for development. Drive material changes from research into production.
* Design Experiments :Design and implement device and process experiments to perform process development and process integration. Extract, analyze,reportand draw logical conclusions on experiments and clarify the statistical significance of the data.
* Team Leadership :Provide team leadership in module developmentwithassembling and coordinating a development team including process engineers, etc.
* Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction,goalsand metrics for success of the team.
* Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developingnew technologiesor devices. Patent disclosures are expected on a regular basis.
* Multi-functional Coordination : Coordinate activities such as reticletape outs, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project toproceedin a rapid and low error manner.
* Technology Transfer :Support the transfer ofnew technologyfrom R&D; to high volume manufacturing.
* Communication & Influence : Communicate key information and projects via presentations and group discussion and drive decisions.
* Continuous Development :Continually grow technical and management skills and pursue continued education via on-job training and trainingclass.
* Integrates Artificial Intelligence (AI)-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,
exercising sound judgment and complying with organizational standards and legal requirements. Successful candidates for this position will have: Must have:
* Passionate about semiconductor technology and innovation.
* Adept at data analysis, problem-solving, and process integration optimization.
* Excellent communication skills and capacity to collaborate within multi-functional teams.
Requirements:
Education:
* PhD≥8yrs, or Master’s ≥11yrs, or Bachelor’s ≥13yrs in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience
* Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
* Ability to develop astrongcomprehensiveend-to-end understanding of particular PImodules on new NAND technologies and related structural & electrical fail mechanisms.
* In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
* Experience in R&D; and technology transfer within Semiconductor industry
* Committed to quality, collaboration, and continuous improvement.
* Ability to be self-motivated, and self-governing with proven track record to work in a demanding & dynamic environment. This announcement is intended to build a talent pipeline of professionals based in Europe who may be interested in future international career opportunities within Micron Technology Inc. and its affiliated group companies worldwide. Opportunities associated with this talent pipeline may require international mobility or reloca
Job Description
As aMember of Technical Staff inNAND Module Process IntegrationTeamthe Singapore R&D; department at MicronSemiconductor Operation Pte Ltd,you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following:
* Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
* Specification definition : Define structural specifications and process requirements for assigned modules.
* Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
* Proactive Issue Resolution: Be proactive inidentifyingpotentialstructure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
* Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
* Material Innovation: Analyze materials physically, electrically, etc. and work with process groups,etcto select new material for development. Drive material changes from research into production.
* Design Experiments :Design and implement device and process experiments to perform process development and process integration. Extract, analyze,reportand draw logical conclusions on experiments and clarify the statistical significance of the data.
* Team Leadership :Provide team leadership in module developmentwithassembling and coordinating a development team including process engineers, etc.
* Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction,goalsand metrics for success of the team.
* Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developingnew technologiesor devices. Patent disclosures are expected on a regular basis.
* Multi-functional Coordination : Coordinate activities such as reticletape outs, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project toproceedin a rapid and low error manner.
* Technology Transfer :Support the transfer ofnew technologyfrom R&D; to high volume manufacturing.
* Communication & Influence : Communicate key information and projects via presentations and group discussion and drive decisions.
* Continuous Development :Continually grow technical and management skills and pursue continued education via on-job training and trainingclass.
* Integrates Artificial Intelligence (AI)-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,
exercising sound judgment and complying with organizational standards and legal requirements. Successful candidates for this position will have: Must have:
* Passionate about semiconductor technology and innovation.
* Adept at data analysis, problem-solving, and process integration optimization.
* Excellent communication skills and capacity to collaborate within multi-functional teams.
Requirements:
Education:
* PhD≥8yrs, or Master’s ≥11yrs, or Bachelor’s ≥13yrs in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience
* Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
* Ability to develop astrongcomprehensiveend-to-end understanding of particular PImodules on new NAND technologies and related structural & electrical fail mechanisms.
* In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
* Experience in R&D; and technology transfer within Semiconductor industry
* Committed to quality, collaboration, and continuous improvement.
* Ability to be self-motivated, and self-governing with proven track record to work in a demanding & dynamic environment. This announcement is intended to build a talent pipeline of professionals based in Europe who may be interested in future international career opportunities within Micron Technology Inc. and its affiliated group companies worldwide. Opportunities associated with this talent pipeline may require international mobility or reloca