Dry Etch Mts/Principal Engineer, Process Development, Advanced Nand

Pubblicato il 07-11-2026 · MICRON · Monza

Overview
In this role you drive innovation in Dry Etch for Next Generation NAND, collaborating with cross-functional teams to shape process roadmaps and equipment strategies. You will mentor engineers, lead complex problem solving, and present technology plans to maintain leadership in memory manufacturing. The position offers high-impact work on critical modules like HAR and staircase etches, with opportunities to influence hardware and process directions. Join a culture that values collaboration, continuous improvement, and technical excellence in a fast-paced, innovation-driven environment.
Retribuzione / Benefits
meal vouchers
corporate welfare
remote working days allowance
supplementary health insurance
life coverage
Employee Assistance Program
Responsabilità
Lead innovation and advancement in Dry Etch technologies for key NAND modules
Develop and optimize dry etch processes to meet structural and electrical specs
Coordinate with hardware teams to define equipment roadmaps for current and next-gen NAND
Demonstrate deep understanding of plasma physics/chemistry and process-parameter effects
Guide cross-functional problem solving and present roadmaps for current/future nodes
Mentor junior engineers and contribute to Technical Leadership Program
Contribute to critical modules such as HAR, Tier-by-tier etches, WL contacts & staircase




Drive opportunities and lead cross-functional task forces to meet targets
Provide updates to upper management on project status and impacts
Lead supplier head-to-heads and manage external collaborations
Integrate AI-assisted tools to improve efficiency, quality, and compliance with standards
Requisiti fondamentali
PhD with 5 years (or Master's with 7 years) in relevant field and at least 6 years of dry etch process development experience
5+ years NAND, DRAM, or Logic module development experience with cross-functional teams
Strong knowledge of plasma physics, plasma chemistry, transport or surface phenomena
Experience leading technical projects and cross-functional teams
Understanding of various plasma dry etch reactors (RF sources, chemistries)
Expertise in statistical process control and analysis
Experience solving scalability problems in deep high aspect ratio etches and pulsing schemes
Lead supplier head-to-heads
Strong communication and leadership skills
Experience with project management and mentoring
Strong analytical and problem-solving abilities
Team player with self-drive
Effective communication and mentoring capability
Dry etch process development
Plasma physics and chemistry knowledge
NAND/DRAM/Logic module development experience
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