Chip-Package Reliability
STMicroelectronics in Italy is offering a role focused on developing and qualifying pad/pad over active structures for Smart Power processes.
La preghiamo di leggere attentamente la seguente descrizione del lavoro per assicurarsi di essere la persona giusta per questo ruolo prima di candidarsi.
You will validate CPI for new technology platforms and run thermo-mechanical simulations to guide design improvements, ensuring robust chip-package interactions. xysqume
The ideal candidate holds a Master’s degree in a relevant field, with strong FE/BE knowledge, FEM tooling proficiency, and business-level English.
La preghiamo di leggere attentamente la seguente descrizione del lavoro per assicurarsi di essere la persona giusta per questo ruolo prima di candidarsi.
You will validate CPI for new technology platforms and run thermo-mechanical simulations to guide design improvements, ensuring robust chip-package interactions. xysqume
The ideal candidate holds a Master’s degree in a relevant field, with strong FE/BE knowledge, FEM tooling proficiency, and business-level English.