Dry Etch Mts/Principal Engineer, Process Development, Advanced Nand
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below.
This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND.
You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP.
You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets.
Your responsibilities include, but are not limited to: Main Responsibilities:
Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications.
Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.
Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
Collaborate and lead cross-functional teams to solve complex structural problems.
Present process and technology roadmaps for current and future technology nodes.
Proactively predict when and how a future issue could arise and build mitigation plans.
Contribute towards the Technical Leadership Program.
Mentor less experienced engineers and encourage skills within the team.
Be associated with critical modules such as HAR, Tier by tier etches, WL contacts
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below.
This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND.
You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP.
You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets.
Your responsibilities include, but are not limited to: Main Responsibilities:
Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications.
Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.
Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
Collaborate and lead cross-functional teams to solve complex structural problems.
Present process and technology roadmaps for current and future technology nodes.
Proactively predict when and how a future issue could arise and build mitigation plans.
Contribute towards the Technical Leadership Program.
Mentor less experienced engineers and encourage skills within the team.
Be associated with critical modules such as HAR, Tier by tier etches, WL contacts