Thermo-Mechanical Chip-Package Engineer (FEM)
STMicroelectronics Italia is seeking an early-career to senior materials/physics/electronics specialist to design and qualify pad/pad over active structures for Smart Power processes.
Prima di candidarsi per questo ruolo, la preghiamo di leggere le seguenti informazioni su questa occasione, riportate di seguito.
The role involves thermo-mechanical simulations and close collaboration with designers to ensure reliable structures. xysqume
You will coordinate CPI validation activities and work with EWS, assembly, and reliability tests across multiple platforms, aiming at robust, manufacturable solutions.
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Prima di candidarsi per questo ruolo, la preghiamo di leggere le seguenti informazioni su questa occasione, riportate di seguito.
The role involves thermo-mechanical simulations and close collaboration with designers to ensure reliable structures. xysqume
You will coordinate CPI validation activities and work with EWS, assembly, and reliability tests across multiple platforms, aiming at robust, manufacturable solutions.
#J-18808-Ljbffr