Chip-Package Interaction Engineer - FEM & Reliability
STMicroelectronics in Agrate Brianza, Italy, is seeking a specialist to develop pad/pad over active structures for Smart Power processes and to qualify them through dedicated tests to release reliable structures.
Sta pensando di candidarsi per questo lavoro? Verifichi tutti i dettagli nella descrizione e poi faccia clic su "Candidati".
You will coordinate activities to validate the CPI of new Smart Power Technology Platforms/Modules and perform xysqume thermo-mechanical simulations (FEM) of chip-package interactions to improve robustness.
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Sta pensando di candidarsi per questo lavoro? Verifichi tutti i dettagli nella descrizione e poi faccia clic su "Candidati".
You will coordinate activities to validate the CPI of new Smart Power Technology Platforms/Modules and perform xysqume thermo-mechanical simulations (FEM) of chip-package interactions to improve robustness.
#J-18808-Ljbffr