Photonics Packaging Engineer — Milan, Lab to Production
Intellectual Capital Resources Ltd in Milan hires a Photonics Packaging Engineer to move PIC devices from lab prototypes toward production-ready modules. You’ll gain hands-on packaging experience within a growing photonics team at an onsite Milan site.
Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D; teams.
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Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D; teams.
#J-18808-Ljbffr